MediaTek recently launched its flagship MediaTek Dimensity 9000 chipset, which includes many fascinating features such as an ARM Cortex X2 Primary core and TSMC’s 4nm fabrication process. It was the most powerful MediaTek chipset we’d seen so far. They are now preparing to launch a new MediaTek Dimensity 7000 chipset. It could be the next powerhouse to emerge from MediaTek’s hub. Leaks and rumors about the chipset have already begun to circulate online. Let’s take a closer look at the leaked specifications for the chipsets.
MediaTek Dimensity 7000 features
The MediaTek Dimensity 7000 chipset will likely be built on TSMC’s 5nm fabrication process. It is worth noting that the TSMC fabrication process has always been thought to be more power-efficient than Samsung’s manufacturing process. However, the chipset’s real-world usage has yet to be revealed. In addition, the chipset will have 4X Cortex A78 performance cores clocked at 2.75GHz and 4X Cortex A55 power efficiency cores clocked at 2.0GHz. It will include a Mali-G510 MC6 GPU unit for graphics. So that was the end of the leaks shared by the tipster Digital Chat Station. The on-paper specifications of the chipset look impressive. The Dimensity 7000 will likely compete with the Qualcomm Snapdragon 778G chipset. Let’s wait for a few more weeks or a month to know more about the chipset.
Here is the possible list of Dimensity 7000-powered phones
- Poco F4
- Redmi K50 Gaming
Dimensity 7000 Processor could be available on the smartphone costing less than INR 40,000. On the Chinese microblogging platform, Weibo, Lu Weibing, General Manager of Redmi, teased a new phone with MediaTek Dimensity 7000 chipset. This could indicate that Redmi will be the first brand to release a smartphone powered by the MediaTek Dimensity 7000 chipset. The handset will likely be called Redmi K50 Gaming.