A confidential Qualcomm data sheet has surfaced, outlining an unannounced midrange chip that appears to be the successor to the Snapdragon 4 Gen 5. The document, obtained by NotebookCheck and dated March 2026, refers to the platform as SM4875 with the codename “Poros.”
The leak carries internal trade secret markings, suggesting it reflects a near-final engineering design rather than early speculation. While Qualcomm has not acknowledged the chip publicly, the details point to a familiar CPU foundation paired with broader platform upgrades.
Familiar CPU, reworked platform
The SM4875 retains the same core CPU layout as the Snapdragon 4 Gen 5. It uses two Kryo Gold cores based on Cortex-A78, each with 256 KB of L2 cache, alongside six Kryo Silver cores based on Cortex-A55, each with 64 KB of L2 cache. All eight cores share a 1 MB L3 cache.
That continuity extends to manufacturing. The chip is still built on TSMC’s 4 nm process, indicating Qualcomm is prioritizing cost stability over raw CPU gains in this tier.
The changes begin elsewhere. GPU architecture jumps from the Adreno 4-series to the Adreno 6-series, marking a generational shift. The previous chip already delivered a claimed 77% uplift over its predecessor, so expectations here center on sustained gains in gaming and UI rendering rather than a single headline jump.
Memory support also expands. LPDDR5 enters the picture with dual-channel configurations at up to 3,200 MHz, while LPDDR4X remains available for lower-cost devices. That flexibility suggests OEMs can segment devices more aggressively without changing the core platform.
Connectivity becomes modular
The connectivity approach is less conventional. Instead of integrating a fixed wireless stack, Qualcomm appears to offer companion chips that are OEM-selectable.
Four WLAN modules are listed. Two older options — WCN3998-2 and WCN3988 — provide Wi-Fi 5 and connect over SLIMbus, mirroring the previous generation. Two newer chips — WCN6750 and WCN6450 — add Wi-Fi 6 support and connect via a single-lane PCIe Gen 3 interface.
That PCIe lane stands out. It seems dedicated to these newer wireless modules rather than general expansion or storage, signaling a targeted design change rather than a broader platform shift.
Bluetooth capability also varies depending on the module. Bluetooth 6.0 is only available when paired with the WCN6450, meaning it’s not a baseline feature of the SoC itself.
There is still a gap. None of the configurations support Wi-Fi 7, leaving the SM4875 behind newer Snapdragon 6-series chips that already include it.
Security updates and a larger footprint
Security hardware sees incremental updates. The platform adds hardware-based ECC image authentication, Widevine L1 support, and a revised Trust Management Engine handling root-of-trust functions.
The physical package grows as well. The SM4875 uses an 11.1 × 12.0 mm PSP917 package, up from the smaller PSP808 used by the SM4850. The increase likely reflects added I/O, including PCIe support and expanded GPIO.
What it means for midrange devices
The overall picture is uneven but intentional. CPU performance may remain largely unchanged, but graphics, memory bandwidth, and wireless flexibility all advance.
For users, that likely translates to smoother gaming, better multitasking under LPDDR5 configurations, and improved connectivity — though the absence of Wi-Fi 7 keeps expectations in check.
Pricing and launch timing remain unclear. The document suggests a release sometime in 2027, but pre-release specifications are often subject to change. The more interesting question is how OEMs will use the modular connectivity approach — whether it leads to clearer device tiers or just more fragmented spec sheets.
