Xiaomi’s founder and CEO Lei Jun previously announced that they would be launching the third version of the Max series which will be called the Xiaomi Mi Max 3. The predecessor Mi Max 2 was a hit with its massive display and a bigger battery. Today the smartphone has cleared 3C certification confirming some of the top specs.
The Mi Max 3 appeared in 3C certification website with model number M1807E8S which hints that it will be a large screen gaming-centric smartphone. According to the spec list, the Mi Max 3 comes with a standard power adapter of “MDY-080ES”. It supports 5VDC 3A / 9VDC 2A / 12VDC 1.5A up to 18W charging power. This confirms that the device will be supporting fast charging technology.
According to the report, the Mi MAX 3 will be powered by a new Qualcomm Snapdragon 710 chipset that the company used on the latest MI 8 SE. It will be customized with two Cortex-A75 large cores clocked at 2.2GHz and six Cortex-A55 clocked at 1.7GHz. It will be supported by the new Kyro 360 CPU architecture supplemented by the Adreno 616 GPU and a multi-core AI (artificial intelligence) engine, whose AI performance is twice than that of it previous Snapdragon 660 chipset.
Also from previous reports it will feature a 7-inch display with 18:9 aspect ratio and backed by a 5,500 mAh massive battery. The Iris scanner present on the Galaxy S series is also supposed to be included in the device. It is coupled with a 4GB RAM and will sport a rear dual camera setup stacked in a vertical arrangement in the top left corner accompanied by a circular fingerprint sensor. It will run on the latest MIUI 10 based on the Android 8.1.0. Other specs of the upcoming Mi Max 3 includes dual SIM card, dual SD card slot, IR blaster, notification lights, audio tuning by Direct, Qualcomm aptX and aptX HD Bluetooth, dual speakers and something called a front “remosic” sensor.
The smartphone will be launched in July. No official dates are confirmed, but we expect a teaser or launch invite soon.