Both the devices may be the first to sport Qualcomm Snapdragon 845 chipset and will run Android 8.1 Oreo
Today details of two new smartphones with model number Sony H8266/H8216 surfaced online in a leaked image. According to the image, these two smartphones are the variants of the same flagship Xperia H82XX 2018. The Sony H8266 was also spotted in GeekBench earlier this week where it achieved a single-core score of 2,393, and a multi-core score of 8,300.
The new Sony Xperia H8216/H8266 will be sporting a 5.48 inch HDR TRILUMINOS X-Reality Display with a resolution of FHD (1920 x 1080 pixels) and protection from Corning Gorilla Glass 5.0. Under the hood, it will be powered by a Qualcomm Snapdragon 845 chipset. There will be two variants: 4 GB + 64 GB internal storage (which is the SONY H8216) and 6 GB + 128 GB internal storage (Which is Sony H8266). Both variants will be carrying expandable memory options up to 256 GB.
The two variants of the device will likely to carry the same optical specs. From the previously leaked image, we know that the devices will feature dual cameras on the rear consisting two 12 MP camera sensor while offering a 15 MP sensor on the front for selfies and video calling. The devices will run on Android 8.1 Oreo and will be backed by a 3210 mAh battery on the SONY H8216 and 3240 mAh battery on the SONY H8266 with Smart Stamina and Qnovo Adaptive Charging along with support from Qualcomm Quick Charge 3.08.
The devices will come with IP86 rated water and dust resistant and measures 157 x 78 x 8.1 mm and 159 g but from the previous report the lower variant measures 148 × 73.4 × 7.4 mm similar to the Xperia XZ1 and weighs 156 g.
The Sony H82XX (H8216 / H8266) is expected to be launched in 2018 making it the first smartphone to be powered by Qualcomm Snapdragon 845 processor. The identity of the device is still unknown, it may be an upgraded version as stated or may start a completely different series. Rumors speculate to be Xperia XZ 1S or Xperia XZ 2 in the 2018 version Xperia.